# CVE-2022-22071

Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music

- Page: https://www.vulneraibility.com/cve/CVE-2022-22071
- CVSS: 8.4
- Known exploited: yes, in CISA KEV since 2023-12-05; CISA due date 2023-12-26
- EPSS: 0.39% (percentile 34.1)
- CISA SSVC: exploitation active, automatable no, technical impact total (assessed 2023-12-07)
- Weakness: CWE-416
- Published: 2022-06-14

## Affected versions

- Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music: affected APQ8053, AR8031, AR8035, CSRA6620, CSRA6640, MDM9150, MSM8953, QCA6174A, QCA6390, QCA6391, QCA6426, QCA6436, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA8337, QCA9377, QCM2290, QCM4290, QCM6490, QCS2290, QCS405, QCS410, QCS4290, QCS610, QCS6490, QRB5165, QRB5165M, QRB5165N, Qualcomm215, SA6155P, SA8155P, SA8195P, SD439, SD460, SD480, SD662, SD680, SD690 5G, SD695, SD750G, SD765, SD765G, SD768G, SD778G, SD780G, SD855, SD865 5G, SD870, SD888 5G, SDX12, SDX55, SDX55M, SDX65, SDXR2 5G, SM4125, SM7250P, SM7325P, WCD9326, WCD9335, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3615, WCN3660B, WCN3680B, WCN3910, WCN3950, WCN3980, WCN3988, WCN3991, WCN3998, WCN3999, WCN6740, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WCN7850, WCN7851, WSA8810, WSA8815, WSA8830, WSA8835

A version outside these ranges is not a statement that it is unaffected.

## References

- [other] https://www.qualcomm.com/company/product-security/bulletins/may-2022-bulletin
- [other] https://www.cisa.gov/known-exploited-vulnerabilities-catalog?field_cve=CVE-2022-22071

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Summary, impact and action are written by the vulneraibility.com AI analysis pipeline from the CVE record, NVD, CISA and FIRST data; verify against the references.